Ease-of-Processing
At Kopin, we say that a complex structure yields a simpler solution. By forming the highly complex transistors prior to shipment to the circuit manufacturer, Kopin reduces the stress of sub-micron processing at our customers. This enables our circuit partners to use mature, high yield design rules to delineate and interconnect the transistors. Therefore, using Kopin's transistor wafers, they can achieve consistently higher yields on their high-performance HBT circuits, even while using simpler, lower cost fab facilities than comparable silicon fabs. These higher yields and lower capital costs translate to lower circuit production costs.

Smaller, More Compact Dies
Due to the vertical nature of the Kopin HBT, the die or chip can be very small. This allows our circuit partners to pack many HBT circuits onto a wafer. This high die count, combined with the simpler, higher yield HBT process, enables circuit companies to generate many circuits and more revenue from each processed wafer, while still lowering circuit prices to their customers.