Kopin's core technology -- Wafer-Engineering™ -- involves bonding dissimilar semiconductor materials together to create advanced electronic components. Kopin's technology has been instrumental in several major breakthroughs including:

CyberDisplay

• Pioneered the world's only transmissive AMLCD using high-performance single-crystal silicon transistors by transferring thin silicon IC layers onto glass with its patented lift-off technology
• Introduced full-color AMLCD with ultra-high pixel density (> 1600 per inch) using color filter technology
• Applied patent-pending low-voltage (LV) architecture in AMLCD to reduce the video voltage levels by 50%, which allows the use of lower cost silicon CMOS driver IC and substantially reduces the power consumption
• Introduced multiple vertical alignment (MVA) AMLCD with wide viewing angle and high contrast ratio
• Developed wide-temperature AMLCD with nearly instant-on operation at temperatures as low as -40^o C

Heterojunction Bipolar Transistor (HBT)

• Enabled the launch of CDMA phone service in 1996 with the introduction of advanced vertical transistors used in the first power amplifier ICs that satisfy the stringent requirements of CDMA phones
• Introduced highly reliable commercial HBT products by engineering the material layer structures
• Developed GAIN-HBT^® technology offering lower voltage operation, higher frequency performance, enhanced temperature stability, and excellent reliability