Kopin's HBT wafer business represents a new model for semiconductor manufacturing. Unlike traditional circuit manufacturing in which entire devices are created in the circuit company's wafer fab, Kopin delivers complete transistors to circuit manufacturers prior to wafer fabrication. The transistors' DC and RF properties are determined by the vertical dimensions of these transistor layers, which are precisely controlled by Kopin's growth process to tolerances within one or two atomic layers. These transistors are then delineated and interconnected by our circuit customers to form high-performance RF integrated circuits.

Circuit manufacturers around the world use Kopin's high-performance transistors to produce advanced circuits for digital cellular phone handsets, high bandwidth wireless and fiber optic telecommunications systems, high-speed instrumentation and advanced mobile appliances. Kopin's HBTs are found in all cell phone platforms, including GSM, GPRS, EGSM, CDMA, CDMA2000 and WCDMA power amplifiers, enabling these circuits to generate clearer, high frequency signals while consuming less power and increasing cell phone talk-time. In addition to cell phones, customers are leveraging our high-performance HBTs for data transmission in WLAN 802.11a and 802.11g applications.