NASDAQ: KOPN $ 3.03 -0.01( -0.33%) Volume: 138,180 July 18, 2018 20 min delay

Kopin Leads GaAs HBT Market with Highest Performing 6-inch Wafers Produced in Industry's Most Advanced Systems

10/11/2007

Company's High-Throughput Systems are the New Powerhouse of Performance and Reliability

TAUNTON, Mass.--(BUSINESS WIRE)--Oct. 11, 2007--Kopin(R) Corp. (NASDAQ: KOPN), the world's leading provider of heterojunction bipolar transistor (HBT) wafers, today announced that its three integrated concept metal-organic chemical vapor deposition (IC MOCVD) systems are producing the industry's highest performing 6-inch HBT wafers with exceptionally good uniformity and reproducibility. These systems have been qualified by multiple customers, a major milestone in Kopin's previously announced plan to increase HBT manufacturing capacity by an additional 50% with the combination of internal expansion and the addition of capacity at its original equipment manufacturer, KTC. Kopin is the only company in the world to produce technologically demanding HBT structures on these systems in volume.

Manufactured by Aixtron, the IC MOCVD systems are the most advanced, highest throughput systems on the market. They are capable of growing seven 6-inch wafers per run, 40% more than the next largest system. The demand for 6-inch HBT wafers among power amplifier circuit manufacturers is expected to grow rapidly over the next two years because of the significant savings in processing costs compared with 4-inch wafers.

"We have begun shipment of 6-inch HBT wafers produced in our IC MOCVD systems, and customer response to the quality of these wafers has been extremely favorable," said Daily Hill, Kopin's senior vice president and general manager of HBT business. "By combining Kopin's proprietary manufacturing processes with the inherent advantages of these advanced IC MOCVD systems, we have improved our "on-wafer" uniformity by a factor of at least two, achieved excellent run-to-run reproducibility, and demonstrated reduced maintenance and higher system uptime. The excellent results validate these advanced production machines as the next-generation workhorses for 6-inch production."

"The outstanding 6-inch HBT results obtained from the largest production systems confirm Kopin's leadership position in the worldwide supply of HBT wafers," said Dr. John C.C. Fan, the Company's president and CEO. "These systems provide the manufacturing efficiencies and cost-saving opportunities to allow us to offer our customers competitive pricing for the highest quality products. This combination of advanced production capability, strong customer support and our financial strength, with approximately $100 million in cash and no debt, makes Kopin a strong partner for our customers."

About Kopin

Kopin Corporation produces lightweight, power-efficient, ultra-small liquid crystal displays and heterojunction bipolar transistors (HBTs) that are revolutionizing the way people around the world see, hear and communicate. Kopin has shipped more than 20 million displays for a range of consumer and military applications including digital cameras, personal video eyewear, camcorders, thermal weapon sights and night vision systems. The Company's unique HBTs, which help to enhance battery life, talk time and signal clarity, have been integrated into billions of wireless handsets as well as into WiFi, VoIP and high-speed Internet data transmission systems. Kopin's proprietary display and HBT technologies are protected by more than 200 global patents and patents pending. For more information, please visit Kopin's website at www.kopin.com.

Kopin and The NanoSemiconductor Company are trademarks of Kopin Corporation.

Safe Harbor Statement

Statements in this news release may be considered "forward-looking" under the "Safe Harbor" provisions of the Private Securities Litigation Reform Act of 1995. These include statements related to the performance of HBT wafers grown by the IC MOCVD systems; the capability, maintenance and system uptime of the IC MOCVD systems; the projection of 6-inch HBT wafer demand among power amplifier circuit manufacturers; and Kopin's leadership position in the worldwide HBT wafer supply. Factors that might affect the actual results, performance or achievements include, among other things, competitive products and pricing; potential fluctuations in demand for Kopin HBT wafers; technological issues that may affect Kopin's ability to produce HBT wafers on its new IC MOCVD systems; difficulty in obtaining the raw materials used to produce the Company's products; the potential that Kopin may be unable to achieve profitability, regardless of its ability to manufacture HBT wafers on these new systems; the possibility that overall demand for wireless handsets might decline; the potential consequences surrounding any findings relating to the Company's special committee's ongoing internal review of stock option granting practices; uncertainty of results of pending civil litigation related to the Company's stock option grant practices; the potential for further delays related to the Company's regulatory filings; general economic and business conditions; and other risk factors and cautionary statements listed in the Company's periodic reports and registration statements filed with the Securities and Exchange Commission. You should not place undue reliance on any forward-looking statements, which speak only as of the date on which they are made. The Company undertakes no responsibility to update any of these forward-looking statements to reflect events or circumstance occurring after the date of this report.

               Kopin - The NanoSemiconductor Company(R)

    CONTACT: Kopin Sales & Marketing
             Nick Kolarich, 508-824-6696
             Director of Worldwide III-V Sales
             nkolarich@kopin.com
             or
             Investor Relations
             Richard Sneider, 508-824-6696
             CFO
             rsneider@kopin.com
             or
             News Media Relations
             RDW Group, Inc.
             Dave McDermitt, 617-235-5812
             VP
             dmcdermitt@rdwgroup.com

    SOURCE: Kopin(R) Corp.