A NEURAL I/o™ WHITE PAPER

The Data Center in a SerDes-Free World

As AI workloads outpace the limits of electrical interconnects, SerDes links are becoming one of the most expensive, power‑hungry bottlenecks inside modern data centers.

Download our latest white paper to dive into how eliminating SerDes layers through emerging Neural I/o™ optical interfaces could one day unlock higher bandwidth density, lower power, and new architectures built for future AI workloads.

Concept of microLED usage as an optical interconnect

Register today to download the latest whitepaper.

MicroLED-based interconnects are the leading edge in infrastructure for AI data centers. Kopin’s expertise in MicroLED materials and fabrication, combined with our innovative system-level design for AI factories, creates a patent-protected technology position that we believe will define the next generation of data-center communication. This is a true technology partnership — Kopin brings the enabling hardware, and together we are building the infrastructure layer that AI factories will require to scale.
Fabric.AI CEO, Josh Silverman

The marriage of our MicroLED technology with our bi-directional NeuralDisplay™ architecture is exactly what the industry needs to break through current interconnect bottlenecks. With Kopin and Fabric.AI’s jointly developed Neural I/o™ technology, we’re creating a faster, more efficient optical interface that is expected to be uniquely capable of supporting GPU-to-GPU communication at the massive scale this market requires — it’s the right technology at the right moment to power the next wave of AI acceleration.
Kopin CEO, Michael Murray