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Co‑developed by Kopin and Fabric.AI, Neural I/o™ MicroLED‑based optical interconnect technology is designed to replace traditional copper and laser systems, delivering ultra‑fast, energy‑efficient data movement for modern AI infrastructure and next‑generation data centers.

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NEURAL I/o™

Built in partnership with Fabric.AI, the leading developer of fabless semiconductor solutions for AI infrastructure, Neural I/o™ interconnect technology is designed to reimagine how data is transferred in smart data centers.

The jointly developed Neural I/o™ optical interconnect technology offering leverages Kopin’s proprietary MicroLED and patented bi-directional NeuralDisplay™ architecture. Designed to repurpose programmable MicroLED pixels as ultra-high-speed optical transceivers, Neural I/o™ is expected to move data at ultra-high speeds while consuming significantly less power per bit than existing solutions.

A 3D render of a black square processor chip centered on a motherboard. Bright blue electrical traces flow across the dark surface, illuminating the pins and surrounding electronic components.

DOWNLOAD THE WHITE PAPER

Our white paper examines this growing connectivity bottleneck and explores how emerging technologies like Neural I/o™—a MicroLED‑based optical interconnect—could help enable faster, more efficient AI infrastructure in the future.

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NEURAL I/o™ ARCHITECTURE

Data centers consume an outsized portion of the world’s energy and are rapidly increasing. Neural I/o™ is designed to deliver the same functional outcome with a fraction of the power by using photons instead of electrons to move data, eliminating the need for copper interconnects and expensive laser‑based systems. The architecture uses each MicroLED pixel as a high-speed transmitter, sending digital bits at extremely fast rates and enabling real-time GPU-to-GPU data exchange at massive scale.

MicroLED-based interconnects are the leading edge in infrastructure for AI data centers. Kopin’s expertise in MicroLED materials and fabrication, combined with our innovative system-level design for AI factories, creates a patent-protected technology position that we believe will define the next generation of data-center communication. This is a true technology partnership — Kopin brings the enabling hardware, and together we are building the infrastructure layer that AI factories will require to scale.

Fabric.AI CEO, Josh Silverman

Designed for the future of AI

Made in the USA

Kopin is the only U.S.-based company with full MicroLED production capability, ensuring secure, domestic manufacturing for next‑generation AI hardware.

Lightning‑Fast Speed

Designed for next‑gen AI workloads, MicroLED technology is expected to unlock lightning‑fast bandwidth and near‑instant GPU‑to‑GPU data exchange.

High Transfer Rate

MicroLED based optical interconnect technology is expected to support high data‑transfer speeds so AI systems receive information quickly, reduce delays and improve overall performance.

Energy Efficient

MicroLED optical interconnects are designed to eliminate power‑hungry copper wiring and laser modules, cutting energy consumption and unlocking sustainable, high‑bandwidth performance.

This collaboration brings together Fabric.AI’s system-level architecture and integration expertise with Kopin’s deep capabilities in MicroLED materials, process development, and high-volume fabrication. Together, the companies are co-developing and sharing intellectual property, accelerating innovation while establishing a strong, defensible position in the rapidly evolving AI infrastructure landscape.

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An artistic rendering of a futuristic data center corridor, featuring rows of server racks illuminated with glowing blue and white light patterns. Intricate digital overlays of lines and data blocks create a sense of high-speed information flow, leading to a bright, radiant light at the far end of the symmetrical hallway.

The marriage of our MicroLED technology with our bi-directional NeuralDisplay™ architecture is exactly what the industry needs to break through current interconnect bottlenecks. With Kopin and Fabric.AI’s jointly developed Neural I/o™ technology, we’re creating a faster, more efficient optical interface that is expected to be uniquely capable of supporting GPU-to-GPU communication at the massive scale this market requires — it’s the right technology at the right moment to power the next wave of AI acceleration.

Kopin CEO, Michael Murray