The trillion‑dollar bottleneck of AI: Connectivity and Power

As copper interconnects reach their physical limits, connectivity—not compute—is emerging as AI’s next critical bottleneck.

Download the white paper to discover how Neural I/o™, a MicroLED-based optical interconnect platform, could help enable faster, more efficient AI infrastructure.

Register today to download the whitepaper.

Register today to download the whitepaper.

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MicroLED-based interconnects are the leading edge in infrastructure for AI data centers. Kopin’s expertise in MicroLED materials and fabrication, combined with our innovative system-level design for AI factories, creates a patent-protected technology position that we believe will define the next generation of data-center communication. This is a true technology partnership — Kopin brings the enabling hardware, and together we are building the infrastructure layer that AI factories will require to scale.

Fabric.AI CEO, Josh Silverman

The marriage of our MicroLED technology with our bi-directional NeuralDisplay™ architecture is exactly what the industry needs to break through current interconnect bottlenecks. With Kopin and Fabric.AI’s jointly developed Neural I/o™ technology, we’re creating a faster, more efficient optical interface that is expected to be uniquely capable of supporting GPU-to-GPU communication at the massive scale this market requires — it’s the right technology at the right moment to power the next wave of AI acceleration.

Kopin CEO, Michael Murray