Kopin Corporation to Present at Ladenburg Thalmann 2019 Technology Expo


Kopin® Corporation (NASDAQ: KOPN), a leading developer of
innovative wearable computing technologies and solutions, announced
today that Dr. John C.C. Fan, Chief Executive Officer will present at
the Ladenburg Thalmann Technology Expo on Thursday, May 30th, 2019, at
9:30 AM ET. The conference will take place at the Park Avenue Convene in
New York City, NY.

A live audio webcast of the event will be made available on the Investor
Relations portion of Kopin’s website under Events & Presentations at http://ir.kopin.com.
A replay of the webcast will be available online at the aforementioned
website following the conclusion of the event.

About Kopin

Kopin Corporation is a leading developer and provider of innovative
wearable technologies and critical components for integration into
wearable computing systems for military, industrial and consumer
products. Kopin’s technology portfolio includes ultra-small displays,
optics, speech enhancement technology, voice-interface and hands-free
control software, low-power ASICs, and ergonomically designed smart
headset reference systems. Kopin’s proprietary components and technology
are protected by more than 300 global patents and patents pending. For
more information, please visit Kopin’s website at www.kopin.com.

Source: Kopin Corporation

Kopin Investor Relations
Richard Sneider, (508) 870 5959


Investor Relations
JoAnn Horne, (415) 445-3233
Market Street